| 摘要 |
The IC socket is capable of obtaining a stable engaging force to meet variations in thickness of the lead of an IC package, when the IC socket comprises a socket body, a plurality of contacts which are arranged on the socket body to be engaged with a plurality of leads while being resiliently depressed from above and a cover which is provided to be vertically movable for the socket body and to depress the contacts to displace them outwardly against their resilience to allow the contacts out of the electrical engagement when the cover is moved down, when the plurality of contacts respectively have a fixing portion which is fixed to the socket body, a contact portion for electrical engagement with the lead (L) of the IC package (P), a cantilever portion which enables the release of the lead (L) and the contact from electrical engagement by rotating or pivoting around the contact portion, and an engaging portion which comes into sliding engagement with the cover, the distance from the contact portion to the bottom side of the contact fixing portion of the single contact before it is inserted into the socket body is smaller than the same distance after mounting the contact in the socket body to provide a preloaded engaging force between the contact and the IC package on the socket body.
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