| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a semiconductor device with a high coefficient of nondefective by easily assuring KGD (Known-Good-Die) of each semiconductor chip, and to utilize the semiconductor device as it is without restraining the position of a terminal, pitches and a signal array of each semiconductor chip, when one packaged semiconductor device is constituted by incorporating a plurality of semiconductor chips. SOLUTION: A protrusion provided to a semiconductor chip mount sealing sub-substrate 100 is bonded to a package substrate 10. Semiconductor bear chips 31 and 32 are arranged in a space formed between the semiconductor chip mount sealing sub-substrate 100 and the package substrate 10 to enable wiring. COPYRIGHT: (C)2006,JPO&NCIPI
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