| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device which enables bonding while keeping clean environment even if a member relating to bonding is arranged in an unstable condition. SOLUTION: A blower 143 is provided to produce an air current so that no dust may enter space surrounding a circuit member 121. In addition, a cover member 144 is provided so that the circuit member may not displace against a circuit member holding part 141 when the air current directly hits the circuit member. Therefore, the displacement of the circuit member to the circuit member holding part can be prevented, and clean environment can be kept, resulting in permitting bonding. COPYRIGHT: (C)2006,JPO&NCIPI
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