| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring pattern inspecting apparatus for reducing the frequency of replacing an optical member. SOLUTION: The wiring pattern inspecting apparatus, optically inspecting a wiring pattern on a top layer of a workpiece 21, comprises a semiconductor package multilayer wiring board having the wiring pattern on a light-transmitting base film. Infrared components in the light emitted from a light source 10 is blocked by a heat-ray blocking filter 12. A band-pass filter 14 selects a wavelength range from a wavelength range of the light having a blocked infrared components so as to maximize the difference between the quantity of the light reflected by the top layer wiring pattern and the quantity of the light reflected by the base film and the wiring pattern. A polarization beam splitter 18 extracts a first linear polarization, having an electric field vector direction orthogonal to the light guided direction from the light in the selected wavelength range, and guides it to aλ/4 plate 20. Theλ/4 plate 20 converts the first linearly polarized light into a circularly polarized light, and makes the workpiece 21 irradiated with it. COPYRIGHT: (C)2006,JPO&NCIPI
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