DEVICES USING RESIN WAFERS AND APPLICATIONS THEREOF
摘要
Devices incorporating a thin wafer of electrically and ionically conductive porous material made by the method of introducing a mixture of a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material into a mold. The mixture is subjected to temperatures in the range of from about 60°C to about 170°C at pressures in the range of from about 0 to about 500 psig for a time in the range of from about 1 to about 240 minutes to form thin wafers. Devices include electrodeionization and separative bioreactors in the production of organic and amino acids, alcohols or esters for regenerating cofactors in enzymes and microbial cells.
申请公布号
WO2006031953(A1)
申请公布日期
2006.03.23
申请号
WO2005US32893
申请日期
2005.09.14
申请人
THE UNIVERSITY OF CHICAGO;LIN, YUPO, J.;HENRY, MICHAEL, P.;SNYDER, SETH, W.;ST. MARTIN, EDWARD;ARORA, MICHELLE;DE LA GARZA, LINDA
发明人
LIN, YUPO, J.;HENRY, MICHAEL, P.;SNYDER, SETH, W.;ST. MARTIN, EDWARD;ARORA, MICHELLE;DE LA GARZA, LINDA