| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a semiconductor device and its fabrication process in which stripping is suppressed in device forming process. <P>SOLUTION: In the process for fabricating a semiconductor device, a semiconductor substrate 101 having an isolation region 103 and a semiconductor region 102 entirely covering the isolation region 103 is prepared, one or a plurality of circuit elements 109 are formed in the semiconductor region 102, and the semiconductor substrate 101 is separated by the isolation region 103. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
