SRAM cell with stacked thin-film transistors

摘要

An integrated circuit memory device according to the invention includes a first column (412) of memory cells (4121) electrically coupled to a first pair of bit lines and a bit line precharge and selection circuit (414,416) which includes a stacked arrangement of a PMIS and a NMOS transistor (N41). These transistors may be thin-film transistors and may include a first PMOS thin-film pull-up transistor and a first NMOS thin-film pass transistor. These transistors are electrically coupled to one of the first pair of bit lines (PBL). The first column of memory cells may include a column of TFT SRAM cells.