发明名称 |
Pressure sensitive adhesive composition for the polishing of the back of a wafer |
摘要 |
<p>A pressure sensitive adhesive composition comprising: (A) a carboxyl group containing copolymer obtained by solution polymerization of (a) a carboxyl group containing polymerizable monomer and (b) another monomer copolymerizable with the monomer (a); (B) a neutralizer; and (C) a crosslinking agent. This pressure sensitive adhesive composition is suitable for use in a wafter surface protective sheet employed for protecting a circuit pattern formed on a wafer surface from cutting debris, etc. at the time of polishing the back of the wafer. When this pressure sensitive adhesive composition is used, not only is the voltage of peel electrification extremely low at the time of stripping of the pressure sensitive adhesive sheet but also, even if the pressure sensitive adhesive remains on the wafer surface, the residual pressure sensitive adhesive can easily be removed by washing with water.</p> |
申请公布号 |
EP0859403(B9) |
申请公布日期 |
2006.03.22 |
申请号 |
EP19980301062 |
申请日期 |
1998.02.13 |
申请人 |
LINTEC CORPORATION |
发明人 |
KATO, KIICHIRO;KONDOH, TAKESHI;TAKAHASHI, KAZUHIRO |
分类号 |
C09J7/02;C08L61/20;C08L63/00;C09J133/02;C09J133/06;C09J133/14;C09J157/10;C09J163/00;C09J175/04;H01L21/302;H01L21/304;(IPC1-7):H01L21/302;C09J157/04 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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