发明名称 |
Process for degassing an aqueous plating solution |
摘要 |
A process for removing oxygen from a copper plating solution is provided. The solution is passed through a degasser comprising a shell and hollow hydrophobic fiber porous membranes wherein the shell while a vacuum is drawn on the surfaces of the fibers opposite the fiber surfaces contacted by the solution. Gas passed through the fiber walls while liquid is prevented from infiltrating the fiber pores. The composition of the solution is monitored so that the composition can be retained substantially constant by adding components of the solution as needed.
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申请公布号 |
US7014679(B2) |
申请公布日期 |
2006.03.21 |
申请号 |
US20030467245 |
申请日期 |
2003.08.06 |
申请人 |
MYKROLIS CORPORATION |
发明人 |
PAREKH BIPIN;LY SAKSATHA;WU QUNWEI |
分类号 |
B01D19/00;B01D61/00;B01D53/22;B01D63/02;B01D71/32;B01D71/36;C23C18/38;C25D3/38;C25D21/04;C25D21/06;C25D21/12 |
主分类号 |
B01D19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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