发明名称 |
Radiating structural body of electronic part and radiating sheet used for the radiating structural body |
摘要 |
A heat dissipating structure for a heat generating electronic component is characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.
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申请公布号 |
US7016196(B2) |
申请公布日期 |
2006.03.21 |
申请号 |
US20030250686 |
申请日期 |
2003.07.17 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
TOMARU KAZUHIKO;MITA KUNIHIKO;YONEYAMA TSUTOMU |
分类号 |
H05K7/20;H01L23/36;H01L23/373;H01L23/42;H01L23/427;H01L23/433 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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