发明名称 Radiating structural body of electronic part and radiating sheet used for the radiating structural body
摘要 A heat dissipating structure for a heat generating electronic component is characterized by comprising a heat dissipating sheet including a metal sheet and a heat conductive member having adhesion stacked thereon between the heat generating electronic component and a heat dissipating member, wherein the metal sheet is connected to the heat generating electronic component, and the heat conductive member having adhesion is connected to the heat dissipating member.
申请公布号 US7016196(B2) 申请公布日期 2006.03.21
申请号 US20030250686 申请日期 2003.07.17
申请人 SHIN-ETSU CHEMICAL CO., LTD. 发明人 TOMARU KAZUHIKO;MITA KUNIHIKO;YONEYAMA TSUTOMU
分类号 H05K7/20;H01L23/36;H01L23/373;H01L23/42;H01L23/427;H01L23/433 主分类号 H05K7/20
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