发明名称 Direct-write laser transfer and processing
摘要 A device and method for depositing a material of interest onto a receiving substrate includes a first laser and a second laser, a receiving substrate, and a target substrate. The target substrate comprises a laser transparent support having a back surface and a front surface. The front surface has a coating that comprises the source material, which is a material that can be transformed into the material of interest. The first laser can be positioned in relation to the target substrate so that a laser beam is directed through the back surface of the target substrate and through the laser-transparent support to strike the coating at a defined location with sufficient energy to remove and lift the source material from the surface of the support. The receiving substrate can be positioned in a spaced relation to the target substrate so that the source material is deposited at a defined location on the receiving substrate. The second laser is then positioned to strike the deposited source material to transform the source material into the material of interest.
申请公布号 US7014885(B1) 申请公布日期 2006.03.21
申请号 US20000619442 申请日期 2000.07.19
申请人 THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY 发明人 PIQUE ALBERTO;AUYEUNG RAYMOND;FITZGERALD JAMES;CHRISEY DOUGLAS B.;WU HUEY-DAW;KYDD PAUL;RICHARD DAVID L.
分类号 C23C14/28;B05D3/00;C23C14/30 主分类号 C23C14/28
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