DIELECTRIC COMPOSITE MATERIAL COMPRISING BENZOCYCLOBUTENE WHICH CONTAINS A FILLER IN ORDER TO DECREASE THE COEFFICIENT OF THERMAL EXPANSION

摘要

A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0. 004.