| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor apparatus which can secure a reliability in the structure of a fuse by preventing a yield reduction by laser trimming, and also to provide a method for manufacturing the semiconductor apparatus. <P>SOLUTION: In the semiconductor apparatus, a metallic fuse wiring line for memory relief is mounted; and an SiCN film 05, an inter-via-layer insulating film 06, and a passivation film are formed on the fuse wiring line 01. Thereafter, the passivation film is removed by etching, and the inter-via-layer insulating film 06 is removed by etch-back. As a result, only the SiCN film 05 remains on the fuse wiring line 01. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
