发明名称 COOLING DEVICE FOR SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a compact and high-performance cooling device for solving a conventional problem that it is difficult to secure a space for piping in front of and behind a cooling plate as to a high density mounting article such as a rack-mounted server, and a high-pressure cooling medium must be adopted to improve cooling performance. SOLUTION: In the cooling device, a flat hollow is formed in the cooling plate 1 and odd-numbered of partition plates 7 are provided in the flat hollow, a suction pipe 5a and a discharge pipe 5b are installed on one side of the cooling plate 1, and a passage is formed in the flat hollow. This structure can be compact because the suction pipe 5a and the discharge pipe 5b are installed on the same side, and further the strength of the cooling plate 1 can be reinforced by providing the partition plates 7 so that a high-performance and high-pressure cooling medium can be used. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006073881(A) 申请公布日期 2006.03.16
申请号 JP20040257225 申请日期 2004.09.03
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKANO MASAO;IKEDA AKIRA
分类号 H01L23/473;H05K7/20 主分类号 H01L23/473
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