| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce a higher harmonic level contained in a transmission signal of a high frequency module for multi-bands in which a power amplifier, a directional coupler, a duplexer and the like are unified. <P>SOLUTION: In a dielectric layer applicable to the inner layer of a multilayer substrate 23, a first internal ground conductor layer 29 is formed corresponding to semiconductor devices 24 and 25 for power amplification for amplifying the sending signal of each transmission system. At the same time, a second internal ground conductor layer 30 is formed corresponding to branch circuits 3a, 3b, 4a and 4c. The first internal ground conductor layer 29 and the second internal ground conductor layer 30 are provided separately each other. The internal ground conductor layers 29 and 30 provided separately are respectively connected to common ground conductor layer 40. Thus, it is separated and the higher harmonics generated from the semiconductor devices 24 and 25 for power amplification intercepts transmission via internal ground conductor layers by providing internal ground conductor layers in a separate way. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
