发明名称 |
PARTS MOUNTING METHOD AND DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a parts mounting method which enables the management of the aging of materials or parts which deteriorate with age, in each circuit board. <P>SOLUTION: Quality information for performing the management of the aging of the materials or the parts which deteriorate with age is associated with each circuit board 18 and is memorized. The materials which deteriorate with age are solder materials or adhesives and the quality information is time from printing solder or time from applying the adhesives. The parts which deteriorate with age are hygroscopic parts, and the quality information is time after mounting the hygroscopic parts. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006074064(A) |
申请公布日期 |
2006.03.16 |
申请号 |
JP20050305404 |
申请日期 |
2005.10.20 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
MAENISHI YASUHIRO;KURIBAYASHI TAKESHI;KAJIYAMA MASAYUKI;MAENISHI YASUTOMO |
分类号 |
H05K13/04;H05K1/02;H05K3/34 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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