发明名称 PARTS MOUNTING METHOD AND DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a parts mounting method which enables the management of the aging of materials or parts which deteriorate with age, in each circuit board. <P>SOLUTION: Quality information for performing the management of the aging of the materials or the parts which deteriorate with age is associated with each circuit board 18 and is memorized. The materials which deteriorate with age are solder materials or adhesives and the quality information is time from printing solder or time from applying the adhesives. The parts which deteriorate with age are hygroscopic parts, and the quality information is time after mounting the hygroscopic parts. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006074064(A) 申请公布日期 2006.03.16
申请号 JP20050305404 申请日期 2005.10.20
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MAENISHI YASUHIRO;KURIBAYASHI TAKESHI;KAJIYAMA MASAYUKI;MAENISHI YASUTOMO
分类号 H05K13/04;H05K1/02;H05K3/34 主分类号 H05K13/04
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