ELECTROLESS GOLD PLATING PRETREATMENT AGENT AND COPPER CLAD LAMINATE FOR FLEXIBLE BOARD

摘要

An electroless plating pretreatment liquid used for copper clad laminates for flexible board whose initial adhesion strength between base material and copper plating layer in ordinary condition and adhesion strength exhibited in a thermal aging resistance test (in air at 150°C for 168 hr) are = 0.4 kgf/cm; and a copper clad laminate for flexible board produced by the use of the electroless plating pretreatment liquid. There is provided an electroless plating pretreatment agent applied to a base material of copper clad laminate for flexible board, characterized in that a silane coupling agent having metal trapping capability and a thermosetting resin are contained therein. Further, there is provided a copper clad laminate for flexible board characterized in that it is produced by treating a base material with the above electroless plating pretreatment agent, thereafter forming a copper plating layer by electroless plating and superimposing thereon a copper plating layer by electroplating.