Method of forming CNT containing wiring material and sputtering target material used for the method

摘要

A method of forming a CNT containing wiring material is conducted by sputtering simultaneously CNT and a metal material on a surface of a substrate to form a CNT containing metal layer, then pattern-etching the CNT containing metal layer to form a wiring pattern. A sputtering target material having a metal material and CNT is used in the method.