| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic substrate that demonstrate superior adhesion characteristics when a mounted component is soldered to a metallized part of a substrate surface, and that provide superior stability when a completed circuit is exposed to high-temperature storage conditions. <P>SOLUTION: A method for forming an electronic circuit comprises a step (a) for coating the substrate with a first conductive composition, a step (b) for drying the first conductive composition to form a dried first metal layer, a step (c) for forming a first calcined metal conductive layer of a calcined double metal layer, a step (d) for coating the first calcined conductive metal layer with a second conductive composition so that the first calcined metal layer is covered with the second conductive composition, a step (e) for drying the second conductive composition to form a second dried metal layer, and a step (f) for calcining the second dried metal layer to form a second layer of the double metal layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
