发明名称 FILM THICKNESS ACQUIRING METHOD
摘要 PROBLEM TO BE SOLVED: To improve correspondence for a system representing a color space unique to a light receiving device and to speedily acquire an in-plane distribution of the thickness of a film provided on a flat plate with a simple constitution in a film thickness acquiring method. SOLUTION: Irradiation light from a light source of which wavelength distribution is broad is made incident on a film provided over a substrate to be measured. Interfering reflected light from the film is measured by a light receiving device. The color variation of the interfering light due to different film thickness where the intensity of the interfering light becomes maximal and minimal for every wavelength of the measured reflected light, is detected in reference with the hue defined by NTSC standard, thereby acquiring the thickness of the film. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006071316(A) 申请公布日期 2006.03.16
申请号 JP20040251942 申请日期 2004.08.31
申请人 TECHNOS KK 发明人 AIKAWA SO
分类号 G01B11/06 主分类号 G01B11/06
代理机构 代理人
主权项
地址