| 摘要 |
<p>According to the present invention, a manufacturing method of a photoelectric converter is provided which comprises the steps of preparing a plurality of substrates (100, 220, 330, 440) on which photoelectric conversion devices are mounted two-dimensionally; installing a plurality of scanning circuit chips (IC-1,...,IC-34) along one side of each of the substrates; installing a plurality of detection circuit chips (SR-1,..., SR-34) along another side of each of the substrates; and after said installing steps, bonding together in a plane the substrates along further another sides of the substrates, along which none of the scanning circuit chips and the detection circuit chips are installed.
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