| 发明名称 |
Polishing Pad |
| 摘要 |
<p>A polishing pad is useful planarizing semiconductor substrates. The polishing pad comprises a polymeric material having a porosity of at least 0.1 volume percent, a KEL energy loss factor at 40°C and 1 rad/sec of 385 to 750 1/Pa and a modulus E' at 40°C and 1 rad/sec of 100 to 400 MPa.</p> |
| 申请公布号 |
EP1522385(A3) |
申请公布日期 |
2006.03.15 |
| 申请号 |
EP20040256170 |
申请日期 |
2004.10.06 |
| 申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. |
发明人 |
JAMES, DAVID B.;KULP, MARY JO |
| 分类号 |
B24B37/00;B24B37/04;B24D3/26;B24D3/28;B24D13/14;C08G18/10;C08G18/48;C08G18/83;C08J5/14;H01L21/304 |
主分类号 |
B24B37/00 |
| 代理机构 |
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