| 发明名称 |
Organosiloxanes |
| 摘要 |
The present invention provides an organosiloxane comprising at least 80 weight percent of Formula I: [Y<SUB>0.01-1.0</SUB>SiO<SUB>1.5-2</SUB>]<SUB>a</SUB>[Z<SUB>0.01-1.0</SUB>SiO<SUB>1.5-2</SUB>]<SUB>b</SUB>[H<SUB>0.01-1.0</SUB>SiO<SUB>1.5-2</SUB>]<SUB>c </SUB>where Y is aryl; Z is alkenyl; a is from 15 percent to 70 percent of Formula I; b is from 2 percent to 50 percent of Formula I; and c is from 20 percent to 80 percent of Formula I. The present composition is useful in semiconductor devices and may be advantageously used as an etch stop.
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| 申请公布号 |
US7011889(B2) |
申请公布日期 |
2006.03.14 |
| 申请号 |
US20020078919 |
申请日期 |
2002.02.19 |
| 申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
BEDWELL WILLIAM B.;HACKER NIGEL P.;LEUNG ROGER Y.;IWAMOTO NANCY;NEDBAL JAN;XIE SONGYUAN;MORO LORENZA;MUKHERJEE SHYAMA P. |
| 分类号 |
B32B9/04;C08G77/04;C08G77/12;G03F7/075;H01L21/312;H01L21/768 |
主分类号 |
B32B9/04 |
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