发明名称 |
LEAD FRAME AND METHOD FOR FABRICATING RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE USING THE SAME |
摘要 |
A lead frame includes: an outer frame section; a plurality of chip mounting sections which are supported by the outer frame section and on which a plurality of semiconductor chips are mounted; lead sections surrounding the chip mounting sections; connecting sections for connecting and supporting the lead sections and the outer frame section with each other; and an encapsulation region in which the chip mounting sections are encapsulated together in an encapsulation resin. An opening is provided in a plurality of regions of the outer frame section that are each located outside the encapsulation region and along the extension of one of the connecting sections. <IMAGE> |
申请公布号 |
KR100559653(B1) |
申请公布日期 |
2006.03.10 |
申请号 |
KR20010076401 |
申请日期 |
2001.12.05 |
申请人 |
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发明人 |
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分类号 |
H01L23/28;H01L21/56;H01L21/68;H01L23/12;H01L23/31;H01L23/495;H01L23/50 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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