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发明名称
MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE
摘要
申请公布号
KR20060022317(A)
申请公布日期
2006.03.10
申请号
KR20040071050
申请日期
2004.09.07
申请人
MICRON PRECISION CO., LTD.
发明人
PARK, SUNG YOUL
分类号
H01L21/56
主分类号
H01L21/56
代理机构
代理人
主权项
地址
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