| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method and semiconductor manufacturing equipment that can surely protect the surface of a chip and can evenly remove a crushed layer, formed after separation into chips. <P>SOLUTION: The semiconductor device manufacturing method comprises processes of forming an element region and an electrode on a semiconductor substrate, forming a protective film on the electrode, pasting a sheet on the protective film, dividing the semiconductor substrate into individual chips, and extending the sheet under controlled prescribed conditions. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
