| 摘要 |
PROBLEM TO BE SOLVED: To improve heat radiation property and soldering property in a semiconductor device which mounts various kinds of semiconductor elements generating comparatively large heat and which is provided with the heat radiation structure of the generated heat. SOLUTION: On a wiring board 11 obtained by forming an opening 18 for facing an LED 1 and a terminal land 16 surrounding the opening 18 at an insulating substrate 13, the LED 1 obtained by providing a heat radiation pad 5 on a mounting surface 3a is mounted in the state of soldering the terminal land 16 and a terminal 4 and floating the LED 1 in the opening 18 and face the pad 5. A heat radiation plate 12 is constituted which has heat conduction property higher than that of the insulating substrate 13, and which has a heat radiation project 19 formed integrally opposing the opening 18 on its main surface 12a for combining wiring board 11. COPYRIGHT: (C)2006,JPO&NCIPI |
