MEMBRANE DEVICE

摘要

PROBLEM TO BE SOLVED: To solve such a problem that a membrane device used as a micro-chemical chip is incapable of performing bonding and causes the formation of voids on the peripheral part of membrane even after bonding when trying to put a thick separation membrane between substrates. SOLUTION: The membrane device is obtained by bonding a plurality of substrates among which at least one substrate has a surface having a recessed part and the separation membrane manufactured in an outside. The separation membrane is held by one substrate among the substrates on lateral parts and a part of one side surface of the separation membrane, and the bonding surface sides of the separation membrane and the substrate are made to be the same level at least on the peripheral part of the held separation membrane. COPYRIGHT: (C)2006,JPO&NCIPI