| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized inexpensive semiconductor element containing no substrate nor lead frame. SOLUTION: Metallic balls 6 which are partially buried in resin sealing sections 8 sealing the semiconductor element 10 and partially projected from the sections 8 are provided in a semiconductor device as outside connecting terminals. The metallic balls 6 are held by the resin sealing sections 8 and connected to the electrodes and bonding wires 12 of the semiconductor element 10 in the sections 8. Flat surfaces 6a are formed in parts of the metallic balls 6, and the bonding wires 12 are joined to the flat surfaces 6a. COPYRIGHT: (C)2006,JPO&NCIPI
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