发明名称 |
Bump structure of semiconductor package and method for fabricating the same |
摘要 |
A bump structure of a semiconductor package and a method for fabricating the same are provided. The bump structure is used to connect a semiconductor element to a carrier of the semiconductor package. The fabrication method primarily employs an electroplating process to form the bump structure including an under bump metallurgy (UBM) layer, at least one I-shaped conductive pillar, and a solder material. This allows fine-pitch electrical connection pads to be arranged in the semiconductor package, and also provides an enhanced support structure and a sufficient height between the semiconductor element and the carrier.
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申请公布号 |
US2006051954(A1) |
申请公布日期 |
2006.03.09 |
申请号 |
US20040026919 |
申请日期 |
2004.12.29 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO, LTD. |
发明人 |
LIN YING-REN;HUANG CHIEN-PING;TSAI HO-YI;HSIAO CHENG-HSU |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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