| 摘要 |
A device for supporting a semiconductor substrate device comprises a sample-holder attached to a treatment chamber including a cooling system and electrical connection means. The device further comprises an intermediate element fixed to the sample-holder by electrostatic means or by means of clamps and electrically and thermally connected to the sample-holder. The intermediate element is removable, has sufficient stiffness to allow manipulation of a thinned substrate that it supports and includes a base consisting of a first material having a higher conductivity than the substrate. A first layer covering the base consists of a second material having a high dielectric strength. First and second electrodes are disposed on the first layer. A second layer covering the first layer and the electrodes consists of a third material having a high dielectric strength.
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