| 摘要 |
The invention relates to a chip capacitor, comprising a substrate (1), provided on the underside thereof with external contacts (11) and on the upper side thereof with contact surfaces (12a, 12b). The chip capacitor comprises a capacitive element, provided with a contact region (23), arranged on the upper surface thereof and a projecting anode contact (22). The capacitive element (2) is mounted directly on the substrate (1) and preferably fixed thereto by means of soldered connections. |
