发明名称 PRINTED WIRING BOARD, LOUDSPEAKER AND MANUFACTURING METHOD PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide the manufacturing method of a printed wiring board reducible in size, a loudspeaker equipped with the printed wiring board, and a manufacturing method of the printed wiring board. SOLUTION: The loudspeaker is provided with a printed wiring board 5 for supplying a speech current to a loudspeaker unit and the loudspeaker unit. The printed wiring board 5 is provided with an insulating substrate 30 and a conductor pattern 31 formed on the insulating substrate 30. The conductor pattern 31 is provided with a base material 35 laminated on the substrate 30, and plating layers 36 and 37 laminated on the base material 35. The rim 30b of the substrate 30 and the rim 35b of the base material 35 are overlapped. The plating layers 36 and 37 cover the rim 35b of the base material 35. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006066567(A) 申请公布日期 2006.03.09
申请号 JP20040246241 申请日期 2004.08.26
申请人 PIONEER ELECTRONIC CORP;TOHOKU PIONEER CORP 发明人 HASHIBA KAZUO
分类号 H05K1/09;H04R9/02;H05K3/24 主分类号 H05K1/09
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