| 摘要 |
PROBLEM TO BE SOLVED: To provide a multiple lead frame with a heatsink, wherein the multiple heatsink and the multiple lead frame can be made small, while stably maintaining mechanical coupling between the multiple heatsink and the multiple lead frame. SOLUTION: The multiple lead frame with the heatsinks is formed by arranging lead frames 1a, whose number is equal to the number of a plurality of semiconductor chips, parts of which form inner leads 2 are integrally molded to the semiconductor chips. The multiple heatsink 20, including the heatsinks 21 whose number, is equal to the number of a plurality of the semiconductor chips and mounted with the semiconductor chips is coupled to the multiple lead frame 1 via coupling parts. The multiple heatsink 20, wherein the heatsinks 21 are connected via heatsink supports 22 respectively, is coupled to the multiple lead frame 1 via the four coupling parts, provided to the outer circumferential part of the multiple lead frame 1. COPYRIGHT: (C)2006,JPO&NCIPI |
