发明名称 METHOD AND APPARATUS FOR MANUFACTURING PRINTED WIRING BOARD
摘要 <p>There are provided a method for preparing a printed wiring board which can form electrostatic latent images at the desired positions of a substrate with good precision, and a uniform and good image can be formed for preparing a printed wiring board having circuits on the both surfaces of the substrate from a material to be developed having at least a metal conductive layer and a photoconductive layer on both surfaces of an insulating substrate in this order, and a preparation device. Toner images corresponding to wiring patterns can be formed on the both surfaces of the material to be developed by placing the material to be developed by a material to be developed-supplying means, subjecting to alignment by a registering means and statically charging at one surface of the material to be developed by a statically charging means, or after statically charging both surfaces of the material to be developed by a statically charging means, subjecting to alignment by a registering means, after forming an electrostatic latent image on the statically charged one surface by an exposure means, subjecting to toner development, if desired, further reversing the material to be developed by a material to be developed-reversing means, again subjecting to alignment and, if necessary, applying static charging, exposing the opposite surface of the electrostatic latent image-formed surface of the material to be developed to form an electrostatic latent image, and subjecting to toner development. <IMAGE></p>
申请公布号 EP1018858(A4) 申请公布日期 2006.03.08
申请号 EP19980917627 申请日期 1998.04.22
申请人 MITSUBISHI PAPER MILLS LIMITED 发明人 KANEDA, YASUO;TAKASE, MASANORI;HYODO, KENJI
分类号 G03G15/22;H05K3/06;(IPC1-7):H05K3/00;G03G13/00;G03G15/00 主分类号 G03G15/22
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