| 摘要 |
PURPOSE:To prevent an extreme infiltration of abrasive from an orientation flat or a notch while grinding by changing a rotational direction of a plate. CONSTITUTION:A plate 14 can regularly or reversely be rotated, and after the plate 14 is regularly rotated and pressed against a wafer to grind, it is stopped, thereafter the plate 14 is reversely rotated to grind a wafer. Incidentally, when the wafer is ground, a carrier plate 20 for holding a wafer is used which is interposed between a center roller 16 and guide rollers 18..., 19... to grind. |
