| 摘要 |
The invention is a process to facilitate contacting of one or several power electronics components ( 10 ) with strip conductors ( 14, 15 ) on a substrate ( 12, 18 ) with the aid of a contact device ( 1 ) with several flat contact elements ( 6, 8 ) that are connected to each other by means of bridges ( 4, 5 ), including the following steps: (a) the contact device ( 1 ) is set on the upper side of the component ( 10 ); (b) the underside of a contact element ( 6, 8 ) is electrically connected both with a contact surface (S, G) on the upper side of a component ( 10 ) and with a strip conductor ( 14, 15 ); (c) at least one of the bridges ( 4, 5 ) between the individual contact elements ( 6, 8 ) is severed by means of thermal gouging. The invention also includes an assembly ( 16, 16' ) produced with the process as well as a contact device ( 1 ) with several flat contact elements ( 6, 7 ) to facilitate contacting of power electronics components ( 10 ).
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