Substrate treating method and apparatus

摘要

A substrate treating method for performing deionized water treatment of substrates with a treating solution including deionized water. The method includes the steps of performing chemical treatment of the substrates with a treating solution including a chemical solution, and supplying deionized water and performing deionized water treatment. The step of performing deionized water treatment is executed by using a treating solution having a specific resistance value lower than a reference specific resistance value of deionized water. The deionized water treatment is terminated in a deionized water treating time that elapses before the reference specific resistance value is attained.