发明名称 SILVER PLATING IN ELECTRONICS MANUFACTURE
摘要 Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.
申请公布号 WO2006022835(A1) 申请公布日期 2006.03.02
申请号 WO2005US05702 申请日期 2005.02.23
申请人 ENTHONE INC.;YAU, YUNG-HERNG;RICHARDSON, THOMAS, B.;ABYS, JOSEPH, A.;WENGENROTH, KARL, F.;FIORE, ANTHONY;XU, CHEN;FAN, CHONGLUN;FUDALA, JOHN 发明人 YAU, YUNG-HERNG;RICHARDSON, THOMAS, B.;ABYS, JOSEPH, A.;WENGENROTH, KARL, F.;FIORE, ANTHONY;XU, CHEN;FAN, CHONGLUN;FUDALA, JOHN
分类号 (IPC1-7):B05D3/10;B05D1/18;B05D5/12;B32B15/20;C09D5/00;C09D5/24;C25D5/22;C25D3/46;C25D5/02 主分类号 (IPC1-7):B05D3/10
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