METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE

摘要

PROBLEM TO BE SOLVED: To realize highly efficient production of a substrate for power module and also realize thinning of a conductor pattern. SOLUTION: A solder material foil 15a is temporarily fixed on the surface of a ceramics substrate by the surface tension force of a volatile organic medium, and a conductor pattern member 13b punched out from a base material 13a is temporarily fixed on the surface of the solder material foil 15a by the surface tension force. Then, they are heated to volatilize the volatile organic medium, and the conductor pattern member 13a is pressurized in the direction of its thickness and the solder material foil 15a is melt to join the conductor pattern member 13b with the surface of the ceramics substrate 12. COPYRIGHT: (C)2006,JPO&NCIPI