发明名称 |
MANUFACTURING METHOD OF WIRING BOARD |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a wiring board capable of simply manufacturing the wiring board at a low cost with high reliability because of a few joints between different materials, with ease of minute wiring, and with less wire resistance because of employing a high groove aspect ratio. <P>SOLUTION: The manufacturing method adopts a step wherein grooves and through-via holes are formed to an insulator sheet on the surface of which an exfoliable sheet is formed, conductor paste is filled into the grooves and through-via holes, and the exfoliable sheet is exfoliated. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
申请公布号 |
JP2006060150(A) |
申请公布日期 |
2006.03.02 |
申请号 |
JP20040243053 |
申请日期 |
2004.08.24 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD;SUGA TADATOMO;TSUKAMOTO KATSUHIDE;NAMICS CORP |
发明人 |
SUGA TADATOMO;TSUKAMOTO KATSUHIDE;AOKURA ISAMU;YOSHII AKITO;KITAMURA MASAHIRO;YAMAGUCHI HIROSHI |
分类号 |
H05K3/46;H01L23/12;H05K3/40 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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