发明名称 MANUFACTURING METHOD OF WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a wiring board capable of simply manufacturing the wiring board at a low cost with high reliability because of a few joints between different materials, with ease of minute wiring, and with less wire resistance because of employing a high groove aspect ratio. <P>SOLUTION: The manufacturing method adopts a step wherein grooves and through-via holes are formed to an insulator sheet on the surface of which an exfoliable sheet is formed, conductor paste is filled into the grooves and through-via holes, and the exfoliable sheet is exfoliated. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006060150(A) 申请公布日期 2006.03.02
申请号 JP20040243053 申请日期 2004.08.24
申请人 MATSUSHITA ELECTRIC IND CO LTD;SUGA TADATOMO;TSUKAMOTO KATSUHIDE;NAMICS CORP 发明人 SUGA TADATOMO;TSUKAMOTO KATSUHIDE;AOKURA ISAMU;YOSHII AKITO;KITAMURA MASAHIRO;YAMAGUCHI HIROSHI
分类号 H05K3/46;H01L23/12;H05K3/40 主分类号 H05K3/46
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