发明名称 Method and apparatus for adjusting characteristics of multi-layer electronic components
摘要 A method for adjusting the characteristics of multi-layer electronic components according to the present invention includes a determination process S 21 for determining the characteristics of a multi-layer electronic component, a calculation process S 22 for calculating the required amount of trimming on the basis of the result of determination obtained in the determination process S 21 , and a trimming process S 23 for applying trimming to a trimming pattern provided in the multi-layer electronic component, in accordance with the amount of trimming obtained in the calculation process. The present invention enables performing the determination process S 21 and the trimming process S 23 in parallel for different multi-layer electronic components instead of performing trimming concurrently with real time determination of characteristics, thus enabling efficiently adjusting the characteristics of plural multi-layer electronic components on aggregate boards.
申请公布号 US2006047355(A1) 申请公布日期 2006.03.02
申请号 US20050211695 申请日期 2005.08.26
申请人 TDK CORPORATION 发明人 KUDOH KAZUO;HIRASAWA MINORU;KANEYUKI TOMOHIKO;MIURA MITSURU
分类号 G06F19/00;B23K26/00;B23K101/42;H03B5/02;H03B5/18;H05K1/16;H05K3/46 主分类号 G06F19/00
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