摘要 |
A method for adjusting the characteristics of multi-layer electronic components according to the present invention includes a determination process S 21 for determining the characteristics of a multi-layer electronic component, a calculation process S 22 for calculating the required amount of trimming on the basis of the result of determination obtained in the determination process S 21 , and a trimming process S 23 for applying trimming to a trimming pattern provided in the multi-layer electronic component, in accordance with the amount of trimming obtained in the calculation process. The present invention enables performing the determination process S 21 and the trimming process S 23 in parallel for different multi-layer electronic components instead of performing trimming concurrently with real time determination of characteristics, thus enabling efficiently adjusting the characteristics of plural multi-layer electronic components on aggregate boards.
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