| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a slurry composition, its production process, and a polishing method of a workpiece employing it. <P>SOLUTION: In the slurry composition exhibiting excellent polishing effect while minimizing damage on a metal layer an oxide film, its production process, and a polishing method of a workpiece employing it, the slurry composition is produced by adding a glycol based compound, e.g. diethylene glycol, ethylene glycol or polyethylene glycol, and an amphoteric surface active agent, e.g. arginine, lysine or proline, to acid aqueous solution containing an oxidizing agent, abrasive, or the like. When that slurry composition is employed in the polishing process of a semiconductor substrate including a metal layer, damage on the metal layer is minimized while sustaining the concentration of oxidizing agent at a constant level and more excellent polishing effect can be attained. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
