摘要 |
Apparatuses and methods for supporting a workpiece such as a semiconductor wafer. A support system is configured to support the workpiece while allowing thermally-induced motion of the workpiece, which may include thermal bowing or thermal bending. The system may include a support member having a moveable engagement portion engageable with the workpiece, the engagement portion being moveable to allow the thermally-induced motion of the workpiece while supporting the workpiece. The moveable engagement portion may include a plurality of moveable engagement portions of a plurality of respective support members, which may be resiliently engageable with the workpiece. The support members may include flexible support members each having an unconstrained portion and a constrained portion, and the moveable engagement portions may include the unconstrained portions. Alternatively, the support members may be rigid and the system may include a plurality of force applicators such as springs in communication with the support members. |
申请人 |
MATTSON TECHNOLOGY CANADA,INC. |
发明人 |
CAMM, DAVID MALCOLM;SEMPERE, GUILLAUME;KALUDJERCIC, LJUBOMIR;STUART, GREGORY;BUMBULOVIC, MLADEN;TRAN, TIM;DETS, SERGIY;KOMASA, TONY;RUDOLPH, MARC;CIBERE, JOSEPH |