| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure for mounting an electronic component which can process signals at high speed and be applied for high-frequency devices, and which can be made compact, thin and highly functional, and to provide its manufacturing method. <P>SOLUTION: A plurality of projecting terminals 10a, 10b and 10c are provided in a first electronic component 9 embedded in a sheet-like thermosoftening and insulating resin layer 11 with a first through hole 13, and are bonded with first circuit conductors 5a, 5b and 5c formed on one surface of the resin layer 11, respectively. An insulating first rein layer 12a with a plurality of second through holes 7a at the given positions for connection of the first circuit conductors 5a, 5b and 5c is arranged and fixed on one surface of the resin layer 11, and the second through hole 7a is filled with a paste conductive resin 8a. Then a plurality of projecting terminals 2a provided in a second electronic component 1a are buried in the conductive resin 8a of the second through hole 7a, and they are cured for connection. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
