| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device capable of cooling the higher temperature portion of the surface of an electronic component with a higher priority. SOLUTION: This cooling device comprises a cooling pipe 2 having a built-in cooling passage 22 through which a refrigerant flows and a cooling surface to be brought in surface contact with the surface of the electronic component, and a cooling fin group 25 consisting of a plurality of cooling fins 250a arranged in the cooling passage 22. The cooling fins 250a are so arranged that they form an uneven cooling efficiency distribution in the cooling surface in the widthwise direction of the cooling passage 22 according to the temperature distribution in the surface of the electronic component. COPYRIGHT: (C)2006,JPO&NCIPI |
