HEAT DISSIPATION DEVICE HAVING CAP FOR PROTECTING THERMAL INTERFACE MATERIAL THEREON

摘要

A heat dissipation device includes a heat sink ( 10 ), thermal interface material ( 30 ) spread on a bottom surface ( 16 ) of the heat sink, two legs ( 22 ) of a clip ( 20 ) disposed at opposite sides of the heat sink, and a protective cap ( 40 ) enclosing the thermal interface material therein. The protective cap includes ears ( 48 ) interlocked with the legs of the clip to retain the protective cap to the heat sink. The legs of the clip are also used for interlocking with engaging member ( 52 ) on a printed circuit board ( 50 ) thereby firmly mounting the heat sink to a CPU ( 54 ) on the printed circuit board.