| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package structure in which reliability at packaging operation is improved by preventing a solder ball from bursting, and absorbing a tension generated by temperature change and a tension generated by impact due to deformation of a pin. <P>SOLUTION: The package structure comprises a device, an internal connection element, a pad and a protective element. The device is connected to a first end of the internal connection element with the pad. The pad and the first end of the internal connection element are covered with the protective element. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
