| 摘要 |
Disclosed is a MEMS device which comprises at least one shape memory material (110, 210, 310, 410, 510, 610, 710, 810, 910, 1030, 1120, 1230) such as a shape memory alloy (SMA) layer and at least one stressed material layer (120, 220, 320, 420, 520, 620, 720, 820, 920, 1050, 1130, 1240). Examples of such MEMS devices include an actuator, a micropump, a microvalve, or a non-destructive fuse-type connection probe. The device exhibits a variety of improved properties, for example, large deformation ability and high energy density. Also provided is a method of easily fabricating the MEMS device in the form of a cantilever-type or diaphragm-type structure. |
