发明名称 |
Stress-compensation layers in contact arrays, and processes of making same |
摘要 |
A stress-compensation layer is formed by pressing a solder bump into a compressible film within a mold chase. The stress-compensation layer flows against the solder bump and the compressible film such that at least a portion of the solder ball is embedded in the stress-compensation layer. The compressible film is removed to reveal at least a portion of the solder bump exposed and free of the stress-compensation layer. An article that exhibits a stress-compensation layer with a surface characteristic of the imposed flexible film is also included. A computing system that includes a stress-compensation layer with a surface characteristic of the imposed flexible film is also included.
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申请公布号 |
US7005321(B2) |
申请公布日期 |
2006.02.28 |
申请号 |
US20040815542 |
申请日期 |
2004.03.31 |
申请人 |
INTEL CORPORATION |
发明人 |
CHEE CHOONG KOOI |
分类号 |
H01L21/48;H01L21/4763;H01L21/56;H01L23/31;H01L23/498;H01L23/52 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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